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Erschienen in:
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2024 | OriginalPaper | Buchkapitel

27. Inductive and Capacitive Coupling Noise in Superconductive VLSI Circuits

verfasst von : Gleb Krylov, Tahereh Jabbari, Eby G. Friedman

Erschienen in: Single Flux Quantum Integrated Circuit Design

Verlag: Springer International Publishing

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Abstract

The increasing complexity of modern superconductive circuits, and single flux quantum (SFQ) circuits in particular, has made the issue of coupling noise of growing importance. Limited metal resources within superconductive circuits have exacerbated this issue. In this chapter, the different sources of coupling noise within SFQ circuits are described. Coupling noise among inductors, routing striplines, and bias microstriplines within SFQ circuits degrades performance while decreasing margins. In this chapter, inductive and capacitive coupling noise between the different layers is characterized. Inductive coupling models between different layers in the MIT LL SFQ5ee process match experimental data within 3%. The dependence of inductive coupling on the thickness of the oxide and metal layer is also discussed. An understanding of inductive and capacitive coupling noise can determine the minimum physical distance between lines. In addition, trade-offs exist among inductive coupling, capacitive coupling, layout complexity, and the vias between ground layers. The different coupling sources are characterized, and guidelines are provided to enhance the automated routing process.

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Vorheriges Kapitel Inductive Coupling Noise in Multilayer Superconductive ICs
Nächstes Kapitel Flux Mitigation in Wide Superconductive Striplines
Literatur
38.
S. Whiteley, E. Mlinar, G. Krylov, T. Jabbari, E.G. Friedman, J. Kawa, An SFQ digital circuit technology with fully-passive transmission line interconnect, in Proceedings of the Applied Superconductivity Conference (2020)
39.
T. Jabbari, G. Krylov, S. Whiteley, E. Mlinar, J Kawa, E.G. Friedman, Interconnect routing for large scale RSFQ circuits. IEEE Trans. Appl. Supercond. 29(5), 1102805 (2019)
41.
T. Jabbari, E.G. Friedman, Global interconnects in VLSI complexity single flux quantum systems, in Proceedings of the Workshop on System-Level Interconnect: Problems and Pathfinding Workshop (2020), pp. 1–7
42.
T. Jabbari, G. Krylov, S. Whiteley, J. Kawa, E.G. Friedman, Repeater insertion in SFQ interconnect. IEEE Trans. Appl. Supercond. 30(8), 5400508 (2020)
57.
T. Jabbari, E.G. Friedman, Transmission lines in VLSI complexity single flux quantum systems, in Proceedings of the PhotonIcs and Electromagnetics Research Symposium (2023), pp. 1749–1759
58.
R. Bairamkulov, T. Jabbari, E.G. Friedman, QuCTS – single flux quantum clock tree synthesis. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(10), 3346–3358 (2022)CrossRef
61.
T. Jabbari, E.G. Friedman, Flux mitigation in wide superconductive striplines. IEEE Trans. Appl. Supercond. 32(3), 1–6 (2022)CrossRef
62.
A. Mitrovic, E.G. Friedman, Thermal modeling of rapid single flux quantum circuit structures. IEEE Trans. Electron. Devices 69(5), 2718–2724 (2022)CrossRef
63.
T. Jabbari, E.G. Friedman, Stripline topology for flux mitigation. IEEE Trans. Appl. Supercond. 335, 1–4 (2023)
65.
T. Jabbari, G. Krylov, S. Whiteley, J. Kawa, E.G. Friedman, Resonance effects in single flux quantum interconnect, in Proceedings of the Government Microcircuit Applications and Critical Technology Conference (2020), pp. 1–5
87.
T. Jabbari, E.G. Friedman, Surface inductance of superconductive striplines. IEEE Trans. Circuits Syst. II Express Briefs 69(6), 2952–2956 (2022)
111.
S.K. Tolpygo, V. Bolkhovsky, T.J. Weir, A. Wynn, D.E. Oates, L.M. Johnson, M.A. Gouker, Advanced fabrication processes for superconducting very large-scale integrated circuits. IEEE Trans. Appl. Supercond. 26(3), 1–10 (2016)CrossRef
137.
T. Jabbari, E.G. Friedman, Inductive and capacitive coupling noise in superconductive VLSI circuits. IEEE Trans. Appl. Supercond. 33(9), 3800707 (2023)
224.
S.S. Meher, C. Kanungo, A. Shukla, A. Inamdar, Parametric approach for routing power nets and passive transmission lines as part of digital cells. IEEE Trans. Appl. Supercond. 29(5), 1–7 (2019)CrossRef
242.
T. Jabbari, R. Bairamkulov, J. Kawa, E. Friedman, Interconnect benchmark circuits for single flux quantum integrated circuits. IEEE Trans. Appl. Supercond. (2023). Under review
249.
S.K. Tolpygo, V. Bolkhovsky, T.J. Weir, C.J. Galbraith, L.M. Johnson, M.A. Gouker, V.K. Semenov, Inductance of circuit structures for MIT LL superconductor electronics fabrication process with 8 niobium layers. IEEE Trans. Appl. Supercond. 25(3), 1–5 (2015)
438.
549.
S.K. Tolpygo, E.B. Golden, T.J. Weir, V. Bolkhovsky, Inductance of superconductor integrated circuit features with sizes down to 120 nm. Supercond. Sci. Technol. 34(8), 1–24 (2021)CrossRef
553.
G. Krylov, E.G Friedman, Inductive noise coupling in multilayer superconductive ICs. Microelectron. J. 126(105336), 1–5 (2022)
566.
C.J. Fourie, C. Shawawreh, I.V. Vernik, T.V. Filippov, High-accuracy InductEx calibration sets for MIT-LL SFQ4ee and SFQ5ee processes. IEEE Trans. Appl. Supercond. 27(2), 1–5 (2017)CrossRef
567.
G. Krylov, E.G Friedman, Inductive noise coupling in superconductive passive transmission lines, in Proceedings of the IEEE International Midwest Symposium on Circuits and Systems (2021), pp. 1–5
591.
R.N. Das, V. Bolkhovsky, S.K. Tolpygo, P. Gouker, L.M. Johnson, E.A. Dauler, M.A. Gouker, Large scale cryogenic integration approach for superconducting high-performance computing, in Proceedings of the IEEE Electronic Components and Technology Conference (2017), pp. 675–683
600.
Y. Mizugaki, A. Kawai, R. Kashiwa, M. Moriya, T. Kobayashi, Mutual coupling between two superconducting strip lines horizontally-placed in niobium integrated chips. J. Phys. Conf. Ser. 234(4), 042021 (2010)
601.
B. Chonigman, A. Shukla, M. Habib, V. Gupta, D. Kirichenko A. Talalaevskii, A. Sahu, A. Inamdar, D. Gupta, Optimization of passive transmission lines for single flux quantum circuits. IEEE Trans. Appl. Supercond. 31(5), 1–6 (2021)CrossRef
602.
T. Yamamoto, K. Inomata, K. Koshino, P-M. Billangeon, Y. Nakamura, J.S. Tsai, Superconducting flux qubit capacitively coupled to an LC resonator. New J. Phys. 16, 015017 (2014)CrossRef
603.
Y.I. Ismail, E.G. Friedman, J.L. Neves, Dynamic and short-circuit power of CMOS gates driving lossless transmission lines. IEEE Trans. Circuits Syst. I Fundam. Theory Appl. 46(8), 950–961 (1999)CrossRef
Metadaten
Titel
Inductive and Capacitive Coupling Noise in Superconductive VLSI Circuits
verfasst von
Gleb Krylov
Tahereh Jabbari
Eby G. Friedman
Copyright-Jahr
2024
Buch
Single Flux Quantum Integrated Circuit Design

Print ISBN: 978-3-031-47474-3

Electronic ISBN: 978-3-031-47475-0

Copyright-Jahr: 2024

DOI
https://doi.org/10.1007/978-3-031-47475-0_27

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